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Parts that are plated with tinned solder types are dipped in a higher Pb concentration solder to create a pressure stress barrier hindering the growth propensity of tin whiskering. We use techniques as recommended by iNEMI for the reduction of tin-whiskering including heat annealing and robotic hot solder dipping. E-Certa's robotic hot solder dipping technique and annealing process makes tin whisker mitigation for lead solder a necessary tool for military and exempted applications. E-Certa's tin whisker mitigation technique is a fluid process with critical attention given to your product's integrity. For pricing information: |
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